Sputtering Target
Sputtering coating refers to the technology that the ions produced by the ion source are accelerated to gather in the vacuum to form a high speed ion beam, which bombards the solid surface, and the kinetic energy exchange between the ions and the solid surface atoms makes the atoms on the solid surface leave the solid and deposit on the surface of the substrate material. The bombarded solid is the raw material for deposition of thin film materials by sputtering method, which is called the sputtering target.
Sputtering targets have important applications in many industries. Purity is one of the key performance indicators for producing a suitable coating, the purity of the sputter coater target greatly affects the performance of the film. Through independent R&D and cooperative development, Acetron have the technical ability to produce ultra-high purity sputtering target metal materials. Previously, Acetron target with a purity reached 99.9999 %, was able to meet the process requirements of the electronics industry.
Acetron, founded in 2002, specializes in leading-edge PVD coating materials, providing highly pure materials for the most demanding coating processes. With over 20 years of experience, we focus on optimizing PVD technology, which is recognized as a sustainable solution that significantly reduces CO2 emissions. Our products, including sputtering targets and evaporation materials, serve diverse industries such as optics, automotive, energy, and medical applications, supporting OEM/ODM needs with accurate tolerances and stable quality. Our commitment to excellence is backed by certifications from our in-house laboratory and international authorities, including ISO9001, IATF16949, ISO14001, and ISO45001. We utilize advanced equipment like SEM, GDMS, and vacuum technology, and we have developed a large automatic bonding production line for sputtering targets, reinforcing our position as a leader in the coating materials industry.
The uniformity and sputtering velocity of the sputtering films are determined by the size, orientation and orientation of the grains. Therefore, the control of grain size and grain direction are the core technologies in the production process of sputtering target material. We have the metal material plastic deformation processing production line and internal tissue structure testing equipment, through scientific process arrangement, can implement precise control of grain crystal direction. Get in touch with us today to discuss your needs!
Rotary Metal Sputtering Targets
A rotary sputter target is a magnetically controlled component shaped like a cylinder with an embedded stationary magnet for rotation. Its key advantage lies in its high utilization rate, albeit at a higher cost.
Rotary Alloy Sputtering Target
Excellent properties such as high purity, high density, Good composition uniformity, Uniform grain, etc.
Planar Ceramic Sputtering Target
Excellent properties such as high purity, high density,Good microstructure uniformity, excellent electrical properties.
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